SK Hynix rumored to exclusively supply Nvidias 12 layer HBM3E

According to Taiwanese media reports, SK Hynix is expected to exclusively supply Nvidia's Blackwell Ultra architecture chip fifth generation 12 layer HBM3E.

It is reported that SK Hynix started mass producing 12 layer HBM3E chips globally in September last year, achieving a maximum capacity of 36GB and a running speed of up to 9.6Gbps. If the large language model Llama 3 70b is driven by a single GPU equipped with four HBM3E products, it can read a total of 70 billion parameters 35 times per second.

Compared to the previous 8-layer product with the same thickness, the capacity has increased by 50%. To achieve this goal, the company will make each DRAM chip 40% thinner than before and use TSV technology for vertical stacking. By applying its core technology Advanced MR-MUF process, it has also solved the structural problems caused by stacking thinner chips higher. This makes the heat dissipation performance of the new generation product 10% higher than the previous generation product, and ensures product stability and reliability by enhancing warpage control.