The first batch of 4nm chips produced by TSMCs US factory has been completed and shipped back to Taiwan for packaging

According to Taiwan media reports, a few days ago, TSMC's fab in Arizona, USA, has completed the first batch of chips manufactured for Apple, NVIDIA and AMD, with a number of 20,000 wafers. At present, the wafers have been sent to TSMC's advanced packaging plant in Taiwan, China, using CoWoS technology for advanced packaging.

It is understood that this batch of 4nm process wafers includes NVIDIA Blackwell AI GPUs, Apple's A-series processors for the iPhone and AMD's fifth-generation EPYC data center processors.

At present, TSMC has not set up a packaging plant in the United States. Previously, TSMC has reached a cooperation with semiconductor packaging giant Amkor to provide one-stop packaging and testing services using Amkor's packaging plant in Peoria, Arizona. Amkor and TSMC will jointly decide on packaging technologies to collaborate, such as TSMC's integrated fan-out (InFO) and CoWoS, to meet the capacity needs of joint customers.